| Diurutkeun | barang | Kamampuhan normal | Kamampuhan husus |
| cacah lapisan | Kaku-flex PCB | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| papan | 0,08 +/- 0,03 mm | 0,05 +/- 0,03 mm | |
| Min.Kandel | |||
| Max.Kandel | 6 mm | 8 mm | |
| Max.Ukuran | 485mm * 1000mm | 485mm * 1500mm | |
| liang & slot | Min. liang | 0,15 mm | 0,05 mm |
| Min. liang liang | 0,6 mm | 0,5 mm | |
| Rasio Aspék | 10:01 | 12:01 | |
| lacak | Min.Width / Spasi | 0,05 / 0,05 mm | 0,025 / 0,025 mm |
| Toleransi | Ngalacak W / S | ± 0,03 mm | ± 0,02 mm |
| (W/S≥0.3mm: ± 10%) | (W/S≥0.2mm: ± 10%) | ||
| Liang ka liang | ± 0,075 mm | ± 0,05 mm | |
| Ukuran liang | ± 0,075 mm | ± 0,05 mm | |
| Impedansi | 0 ≤ Nilai ≤ 50Ω : ± 5Ω 50Ω ≤ Nilai : ± 10%Ω | ||
| Bahan | Spésifikasi Basefilm | PI: 3mil 2mil 1mil 0,8mil 0,5mil | |
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm supplier utama | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Spésifikasi Coverlay | PI: 2 jt 1 jt 0,5 jt | ||
| Warna LPI | Héjo / Konéng / Bodas / Hideung / Biru / Beureum | ||
| PI Stiffener | T: 25um ~ 250um | ||
| FR4 Stiffener | T: 100um ~ 2000um | ||
| SUS Stiffener | T: 100um ~ 400um | ||
| AL Stiffener | T: 100um ~ 1600um | ||
| pita | 3M / Tésa / Nitto | ||
| EMI shielding | Pilem pérak / Tambaga / mangsi pérak | ||
| Beungeut bérés | OSP | 0.1 - 0.3um | |
| HASL | Sn: 5um - 40um | ||
| HASL (Leed bébas) | Sn: 5um - 40um | ||
| ENEPIG | Ni: 1.0 - 6.0um | ||
| Ba: 0,015-0,10um | |||
| Au: 0,015 - 0,10um | |||
| Plating emas teuas | Ni: 1.0 - 6.0um | ||
| Au: 0.02um - 1um | |||
| Flash emas | Ni: 1.0 - 6.0um | ||
| Au: 0.02um - 0.1um | |||
| ENIG | Ni: 1.0 - 6.0um | ||
| Au: 0.015um - 0.10um | |||
| Imesion pérak | Ag: 0.1 - 0.3um | ||
| Plating Tin | Sn: 5um - 35um | ||
| SMT | Tipe | 0.3mm pitch Panyambungna | |
| 0.4mm pitch BGA / QFP / QFN | |||
| 0201 komponén |